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BRIGHT LED ELECTRONICS CORP.
SURFACE MOUNT CHIP LED LAMP SPECIFICATION COMMODITYAXIAL TYPE LED DEVICE NUMBERBL-XE1361-TR9 ELECTRICAL AND OPTICAL CHARACTERISTICS (Ta=25)
Chip Emitted Color Hi-Eff Red Absolute Maximum Rating
PAGE: REVISION:
Electro-optical Data (At 20mA)
2 1.0
Viewing Angle 21/2 (deg) 35
Lens Peak Dominant Wave Wave Vf(V) Iv(mcd) If Peak Length Length Appearance Pd (nm) (mW) (mA) If(mA) Typ. Max. Min. Typ. P(nm) d(nm) 640 6285 Water Clear 40 80 30 100 2.0 2.6 18.5 40.0
Remark1.Viewing angle is the Off-axis angle at which the luminous intensity is half the axial luminous intensity. 2. This product doesn't contain restriction substance ,comply ROHS standard ABSOLUTE MAXIMUN RATINGS (Ta=25) Reverse Voltage ........................................................................................................................ 5V Reverse Current (VR=5V) ...................................................................................................... 100A Operating Temperature Range ...................................................................................... -25 80 Storage Temperature Range ...................................................................................... -30 85 Preheating Temperature ....................................................................... 100 ~ 150 Within 2 Minutes Soldering Temperature ........................................................................ 240 ~ 250 Within 5 Seconds PACKAGE DIMENSIONS
NOTES: 1.All dimensions are in millimeters (inches). 2.Tolerance is 0.25mm (0.01") unless otherwise specified. 3.Specifications are subject to change without notice.
BRIGHT LED ELECTRONICS CORP.
LED LAMP SPECIFICATION PAGE: REVISION: 3 1.0 COMMODITYAXIAL TYPE LED LAMP DEVICE NUMBERBL-XE1361-F9
BRIGHT LED ELECTRONICS CORP.
AXIAL LED LAMP SPECIFICATION COMMODITYAXIAL TYPE LED LAMP DEVICE NUMBERBL-XE1361-TR9 TAPPING AND PACKAGING SPECIFICATION
ITEM SYMBOL mm Tape Feed Hole Diameter (DIA) Feed Hole Location Centers Line Dimensions Length Direction Compartment Depth Carrier Tape Overall Thickness Compartment Pitch Sprocket Hole Diameter Centers Line Dimensions Length Direction Carrier Tape Thickness Carrier Tape Width Flange Diameter Hub Spindle Hole Hub Diameter Fixing Tape Width Flange Space Between Flanges Compartment Length Compartment Width D0 E F K0 K P P0 P2 t W A C D2 W1 T A0 B0 1.40 1.65 5.45 3.00 3.00 3.90 3.90 1.95 12.00 178.0 12.50 20.00 9.00 16.00 1.87 6.30 Minimum inch 0.055 0.065 0.215 0.118 0.118 0.153 0.153 0.076 0.472 7.008 0.492 0.788 0.354 0.629 0.074 0.248 mm 1.55 1.85 5.55 3.20 3.20 4.10 4.10 2.05 0.30 12.30 180.0 13.50 21.50 9.30 17.00 2.07 6.50
PAGE:
SPECIFICATION Maximum inch 0.061 0.072 0.218 0.126 0.126 0.161 0.161 0.080 0.012 0.484 7.087 0.531 0.846 0.366 0.669 0.081 0.256
4
REVISION: 1.0
Anode
Cathode
BRIGHT LED ELECTRONICS CORP.
SURFACE MOUNT CHIP LED LAMP SPECIFICATION
RELIABILITY TEST
Test Item Reference Standard Operation Life MIL-STD-750:1026 MIL-STD-883:1005 JIS C 7021 :B-1 High Temperature MIL-STD-202:103B High Humidity JIS C 7021 :B-11 Endurance Storage Test High MIL-STD-883:1008 Temperature JIS C 7021 :B-10 Storage Low Temperature JIS-C-7021 :B-12 Storage Temperature MIL-STD-202:107D Cycling MIL-STD-750:1051 MIL-STD-883:1010 JIS C 7021 :A-4 Thermal Shock MIL-STD-202:107D Environmental MIL-STD-750:1051 Test MIL-STD-883:1011 Solder MIL-STD-202:201A Resistance MIL-STD-750:2031 JIS C 7021 :A-1 Classification
PAGE: REVISION:
5 1.0 Result 0/20
Test Conditions Connect with a power If=20mA Ta=Under room temperature Test time=1,000hrs Ta=+65 5 RH=90%-95% Test time=240hrs High Ta=+85 5 Test time=1,000hrs Low Ta=-35 5 Test time=1,000hrs -35 ~ +25 ~ +85 ~ +25 60min 20min 60min 20min Test Time=5cycle -35 5 ~+85 5 20min 20min Test Time=10cycle Preheating 140-160,within 2 minutes. Operation heating 235(Max.), within 10seconds. (Max.)
0/20
0/20
0/20
0/20
0/20
0/20
JUDGMENT CRITERIA OF FAILURE FOR THE RELIABILITY Measuring items Forward voltage Reverse current Luminous intensity Note: Symbol VF ( V) Ir(uA) Iv ( mcd ) Measuring conditions If=20mA Vr=5V If=20mA Judgement criteria for failure Over Ux1.2 Over Ux2 Below SX0.5 S means initial value.
1.U means the upper limit of specified characteristics. ambient conditions after completion of each test.
2.Measurment shall be taken between 2 hours and after the test pieces have been returned to normal
BRIGHT LED ELECTRONICS CORP.
SURFACE MOUNT CHIP LED LAMP SPECIFICATION PAGE: REVISION: 1. SOLDERING: 6 1.0
Manual Of Soldering The temperature of the iron tip should not be higher than 300(572) and Soldering within 3 seconds per solder-land is to be observed. Reflow Soldering Preheating : 140~160 5,within 2 minutes. Operation heating : 235(MAX.) within 10 seconds.(Max) Gradual Cooling (Avoid quenching).
10 SEC. MAX.
DIP soldering (Wave Soldering) Preheating : 120~150,within 120~180 sec. Operation heating : 245 5 within 5 sec.260 (Max) Gradual Cooling (Avoid quenching).
TEMPERATURE TEMPERATURE
140~160
235 MAX. 4 /SEC. MAX.
4 /SEC. MAX. OVER 2 MIN.
TIME
Soldering heat Max. 260 120~150 245 5 within 5 sec.
Preheat 120~180 sec.
TIME
2. Handling : Care must be taken not to cause to the epoxy resin portion of BRIGHT LEDs while it is exposed to high temperature. Care must be taken not rub the epoxy resin portion of BRIGHT LEDs with hard or sharp article such as the sand blast and the metal hook.
BRIGHT LED ELECTRONICS CORP.
SURFACE MOUNT CHIP LED LAMP SPECIFICATION PAGE: REVISION: 3. Notes for designing: 7 1.0
Care must be taken to provide the current limiting resistor in the circuit so as to drive the BRIGHT LEDs within the rated figures. Also, caution should be taken not to overload BRIGHT LEDs with instantaneous voltage at the turning ON and OFF of the circuit. When using the pulse drive care must be taken to keep the average current within the rated figures. Also, the circuit should be designed so as be subjected to reverse voltage when turning off the BRIGHT LEDs. 4. Storage: In order to avoid the absorption of moisture, it is recommended to solder BRIGHT LEDs as soon as possible after unpacking the sealed envelope. If the envelope is still packed, to store it in the environment as following: (1) Temperature : 5-30(41)Humidity : RH 60Max. (2) After this bag is opened, devices that will be applied to infrared reflow, vapor-phase reflow, or equivalent soldering process must be: a. Completed within 24 hours. b. Stored at less than 30% RH. (3) Devices require baking before mounting, if: (2) a or (2) b is not met. (4) If baking is required, devices must be baked under below conditions: 12 hours at 60 3. 5. Package and Label of Products: (1) Package: Products are packed in one bag of 3000 pcs (one taping reel) and a label is attached on each bag. (2) Label:
BRIGHT LED LOGO Part No. Quantity BIN. Sealing Date x xx Year xx Month xx Day
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